On February 26, 2025, the Asia Photonics Expo 2025 officially commenced at Hall L1 of the Marina Bay Sands Expo and Convention Centre in Singapore. As a global platform for optoelectronics industry collaboration, this year's event attracted over 350 exhibitors from more than 70 countries and regions. Our company showcased high-speed optical module PCB and high-reliability ceramic substrates at Booth C232, with our technical and marketing teams engaging in full-time communication. We cordially invite global clients and partners to visit our booth for discussions.
100G/400G/800G High-Speed Optical Module PCBs:
Supporting current mainstream optical communication rates and future R&D requirements, these products employ ultra-low-loss substrates and precision machining processes. They are tailored for hyperscale applications including AI data centers and communication base stations.
DPC and AMB Ceramic Substrates:
Mass-produced for automotive LiDAR packaging, industrial laser packaging, and IGBT power module encapsulation, these solutions deliver efficient thermal management for high-power devices.
Day 1 Highlights:
Our booth attracted global industry experts and corporate representatives on the opening day. Technical discussions with clients yielded multiple preliminary cooperation agreements regarding emerging trends and collaboration opportunities. We look forward to exploring further partnerships to advance optoelectronic innovation and applications.
